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Title: Design optimization of a micro-channel on copper substrate using wire-EDM for VLSI application
Authors: Singh J
Kumar R
Srivastava P.
Keywords: Genetic algorithm
Teaching learning based optimization
Wire EDM
Issue Date: 2020
Publisher: Innovare Academics Sciences Pvt. Ltd
Abstract: Nowadays, cooling applications in the area of electronic instruments such as heat sinks are widely used and efficient cooling can enhance the performance of the electronic instruments. The heat sink used in this study is micro-channels made up of copper substrate through which liquid is passed for removing the heat of the electronic components. For maintaining the volumetric flow rate of cooling liquid through the Micro channels as per the required cooling rates, a certain pressure gradient is required to be maintained which depends upon several factors including the friction and roughness in the Micro channels . Therefore, the surface roughness of Micro channels in heat sinks should be as least as possible. In the present work, micro-channels are fabricated in the copper substrate using Wire-EDM. Three input parameters (peak current ranges 100 to 200 Ampere, on-time pulses range 105 to 115 �sec and off-time pulse rages 25 to 45 �sec) of Wire EDM are varied and found two output responses (material removal rate and surface roughness). Further input and output parameters are correlated by using Response Surface Methodology (RSM). In this paper GA and TLBO algorithm is used for manufacturing tolerances and optimal selection of design to obtain the global optimal solution. The mathematical models obtained by regression analysis are used for optimizing the parameters. The surface roughness is observed 1.1819� and 1.1812� by using GA and TLBO, respectively and the material removal rate obtained is 6.73865 mm3/min and 6.743737 mm3/min, respectively. Subsequently, the least surface roughness and higher material removal rate values are reported as 2.64246�m and 4.1259 mm3/min, respectively. � 2020 Innovare Academics Sciences Pvt. Ltd. All rights reserved.
URI: 10.31838/jcr.07.19.27
Appears in Collections:Journals

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